POPA Recon[Economic Daily (UDN)]President Winbond "TSMCUnlikely to advance to 3D DRAM "• Chairman Winbond Zhao Yu-jun commented that TSMC is unlikely…
[Economic Daily (UDN)]President Winbond "TSMCUnlikely to advance to 3D DRAM "• Chairman Winbond Zhao Yu-jun commented that TSMC is unlikely to be directly involved in the development of 3D DRAM products for NVIDIA. • There is a huge amount of R&D money and time and a huge number of patent barriers to entering the DRAM market, and TSMC has alreadySamsung Electronics· You pointed out that you are building a cooperative ecosystem with Winbond and others. • Demand for the adoption of facilities in AI data centers and semiconductor supply chains is projected to be highly visible from 2027 to 2028,…
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