POPA ReconThe memory supercycle does not end with expansion source
The memory supercycle does not end with expansion source AI is not just about buying more memory 1. Consumes much more wafers to produce the same capacity - Global DRAM production capacity, which is 2 million WPM in 2026, will reach 4.8 million WPM in 2030 even if all aggressive capacity expansions such as Samnic are reflected. - The problem is HBM’s wafer consumption. Due to TSV, wide I/O, stacking, and yield issues, HBM4E requires four times more effective wafer capacity than regular DRAM to supply the same memory bits. - Assuming 30 million AI accelerators and server CPU demand in 2030, to…
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