POPA Recon1) AI Compute/Chip (Direct Beneficiary)
1) AI Compute/Chip (Direct Beneficiary) • NVDA, AMD, AVGO (커스텀 ASIC), TSM, ARM • Korea: 005930 (Samsung), 000660 (SK Hynix) — Direct Beneficiary of HBM 2) Semiconductor equipment/packaging (CoWoS bottleneck) • ASML, AMAT, LRCX, KLAC, Tokyo Electron • Korea: 042700 (Korea-U.S. Semiconductor) — HBM TC Bonder Exclusive 3) Power (the bottleneck most emphasized by the author) • 원전/SMR: CEG, VST, TLN, OKLO, SMR, BWXT • Natural Gas: EQT, RRC, AR (Marcelus Shale) • Korea: 034020 (Doosan Efficiency) — SMR + Gas Turbine 4) Power Infrastructure/Grid (Lack of Transformers/Turbines) • GEV(GE Ver…
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